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Daimler-Benz Aerospace AGFried. Krupp GmbHGebrueder SulzerNippon Steel Nisshin Co., Ltd.LIXIL Corp. /Old/Koenig & Bauer AGKoenig & Bauer AGTaiheiyo Cement Corp.Kennametal, Inc.China Construction Eighth Engineering Division Corp. Ltd.China Construction Second Engineering Bureau Co., Ltd.United States Gypsum Co.China Railway Siyuan Survey & Design Group Co., Ltd.United States Gypsum Co.Combustion Engineering, Inc.Primetals Asset Management U.K. Ltd.Saint-Gobain TM KKZhejiang Yasha Decoration Co., Ltd.Albemarle Corp.Paul Wurth SAJohns Manville Corp.Powerchina Huadong Engineering Corp. Ltd.Powerchina Huadong Engineering Corp. Ltd.Shanghai Baoye Group Co., Ltd.Graco, Inc.China Construction Seventh Engineering Division Corp. Ltd.SMS group GmbHKorea Institute of Construction TechnologyThe First Co. of China Eighth Engineering Bureau Ltd.RHI Magnesita Deutschland AG
Commercial Aircraft Corp. of China Ltd.Curtiss-Wright Corp.First Principles, Inc.Astronics AeroSat Corp.DZYNE Technologies, Inc.EloretArea-I, Inc.Modern Technology Solutions, Inc.Pressure Systems, Inc.Flight Research, Inc.Ideal Aerosmith, Inc.Integrated Dynamics, Inc.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyWaymo LLCRenishaw PlcSRI InternationalRyobi Ltd.Shibuya Corp.Tatsuno Corp.
International Business Machines Corp.Microsoft Corp.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Wistron Corp.Orange SAOrion Co., Ltd.Tata Consultancy Services Ltd.NetEase (Hangzhou) Network Co., Ltd.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.NAVER Corp.NEC Soft Ltd.ThyssenKrupp Presta AGBeijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.Mosaid Technologies, Inc.Power Integrations, Inc.TRUMPF Werkzeugmaschinen GmbH + Co. KGBaidu USA LLCAsahi Techno Co., Ltd.Megvii (Beijing) Technology Co., Ltd.Intel Deutschland GmbHUnited Video Properties, Inc.Miracle Automation Engineering Co., Ltd.Miracle Automation Engineering Co., Ltd.Xing, Inc.Hangzhou Hikvision System Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.