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BOE Technology Group Co., Ltd.Fraunhofer-Gesellschaft eVIndustrial Technology Research InstituteBeijing University of TechnologyNanjing University of TechnologyEPISTAR Corp.National Taiwan UniversityTianma Microelectronics Co., Ltd.Unimicron Technology Corp.Lextar Electronics Corp.The Hong Kong University of Science & TechnologyKorea Photonics Technology InstituteUniversity of Hong KongThe Research Foundation of The City University of New YorkLumens Co., Ltd.Aledia SASPlessey Semiconductors Ltd.Nano & Advanced Materials Institute Ltd.Ostendo Technologies, Inc.PlayNitride, Inc.VueReal, Inc.Oculus VR, Inc.Luminescence Technology Corp.Hansol Chemical Co., Ltd.eMagin Corp.Korea Advanced Nano Fab CenterRohinni LLCEpilight Technology Co. Ltd.GLO ABLuminit LLC
Canon, Inc.Canon, Inc.Ricoh Co., Ltd.Fujifilm Business Innovation Corp.Casio Computer Co., Ltd.Olympus Corp.Fraunhofer-Gesellschaft eVMinolta Co., Ltd.Hamamatsu Photonics KKDaihatsu Motor Co., Ltd.DISCO Corp.Koito Manufacturing Co., Ltd.Nichia Corp.OSRAM Opto Semiconductors GmbHEthicon, Inc.JSWKennametal, Inc.Hisense Visual Technology Co., Ltd.Shibaura Mechatronics Corp.Polyplastics Co., Ltd.Lite-On Technology Corp.Han's Laser Technology Industry Group Co., Ltd.Canon Electronics, Inc.Waymo LLCGwangju Institute of Science & TechnologyShibuya Corp.HERE Global BVPixArt Imaging, Inc.KEYENCE Corp.Leica Geosystems AG
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Gree Electric Appliances, Inc. of ZhuhaiBrother Industries, Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.
Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Siliconware Precision Industries Co., Ltd.Qimonda AGUnimicron Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.Amkor Technology, Inc.NEPES Corp.HANA MICRON, Inc.Camtek Ltd.Niko Semiconductor Co., Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Trust Alliance Information Development Inc., Ltd. ShanghaiTrust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Seoul National UniversityJ-Devices Corp.Conexant Systems LLCDeca Technologies, Inc.Tera Probe, Inc.CONNECTEC JAPAN Corp.Palomar Technologies, Inc.Interconnect Systems, Inc.
Opple Lighting Co., Ltd.Ledvance GmbHAledia SASFreiberger Compound Materials GmbHPlayNitride, Inc.VueReal, Inc.Sino Nitride Semiconductor Co., Ltd.Sino Nitride Semiconductor Co., Ltd.Soraa, Inc.Sunpartner Technologies SASpureLiFi Ltd.Lucibel SADelta Light NVDigital Lumens, Inc.LightPointe Communications, Inc.Soitec Belgium NVLuceco plcIlumi Solutions, Inc.Outstanding Technology Co., Ltd.Qmat, Inc.Fulham Co., Inc.Lumiode, Inc.Best Lighting Products, Inc.IOTA Engineering LLCByteLight, Inc.
Shinko Electric Industries Co., Ltd.Qimonda AGUnimicron Technology Corp.Powertech Technology, Inc.Mentor Graphics Corp.Xintec, Inc.NEPES Corp.HANA MICRON, Inc.Camtek Ltd.Subtron Technology Co., Ltd.Niko Semiconductor Co., Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Ultrasonic Engineering Co. Ltd.Tianshui Huatian Technology Co., Ltd.Zuken Ltd.Shanghai Meadville Science & Technology Co., Ltd.Trust Alliance Information Development Inc., Ltd. ShanghaiShanghai Meadville Science & Technology Co., Ltd.Trust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Seoul National UniversityJ-Devices Corp.Conexant Systems LLCDeca Technologies, Inc.Shinkawa Electric Co., Ltd.Tera Probe, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.
Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.Samsung Electro-Mechanics Co., Ltd.United Microelectronics Corp.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Advanced Semiconductor Engineering, Inc.Siliconware Precision Industries Co., Ltd.Qimonda AGUnimicron Technology Corp.STATS ChipPAC Pte Ltd.Adeia Semiconductor Technologies LLCPowertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.Chipbond Technology Corp.King Yuan Electronics Co., Ltd.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.HANA MICRON, Inc.Camtek Ltd.Niko Semiconductor Co., Ltd.Samsung Semiconductor, Inc.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.