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VIA Technologies, Inc.Canon Marketing Japan, Inc.Hitachi Advanced Digital, Inc.Asahi Techno Co., Ltd.Hanwang Technology Co., Ltd.YGsoft Inc.Yonyou Network Technology Co., Ltd.Shanghai Baosight Software Co., Ltd.Glodon Co., Ltd.Shanghai Baosight Software Co., Ltd.Newland Digital Technology Co., Ltd.Beijing Ultrapower Software Co., Ltd.Hundsun Technologies, Inc.Henan Splendor Science & Technology Co., Ltd.Henan Splendor Science & Technology Co., Ltd.Adesto Technologies Corp.Beijing Watertek Information Technology Co., Ltd.Beijing Watertek Information Technology Co., Ltd.Goldpac Ltd.Innodisk Corp.Wisesoft Co., Ltd.Wonders Information Co., Ltd.Surfilter Network Technology Co., Ltd.Surfilter Network Technology Co., Ltd.XMOS Ltd.International Laboratory Corp.Haystack Technologies, Inc.YLZ Information Technology Co., Ltd.Vecima Networks, Inc.iBasis, Inc.
Electronics & Telecommunications Research InstituteASML Netherlands BVHyundai MicroElectronics Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesNovatek Microelectronics Corp.Beijing NAURA Microelectronics Equipment Co., Ltd.JOLED, Inc.Shanghai Huali Microelectronics Corp.Shanghai Huali Microelectronics Corp.Asahi Kasei Microdevices Corp.Tianma Microelectronics Co., Ltd.Wuhan Tian Ma Microelectronics Co., Ltd.Shanghai Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Heraeus Precious Metals GmbH & Co. KGElectro Scientific Industries, Inc.Sanechips Technology Co., Ltd.Nuvoton Technology Corp.MPI Corp.LX Semicon Co., Ltd.Fujitsu Microelectronics, Inc.ELAN Microelectronics Corp.InvenSense, Inc.Kateeva, Inc.Raydium Semiconductor Corp.Aselsan Elektronik Sanayi ve Ticaret ASShanghai AVIC Optoelectronics Co., Ltd.CMC Materials, Inc.Hangzhou Silan Microelectronics Co., Ltd.
Imperial Chemical Industries Ltd.KYOCERA Chemical Corp.Daikin Airconditioning France SASDAIKIN INDUSTRIES Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Illinois Tool Works, Inc.Fujitsu General Ltd.ABB Automation, Inc.Idemitsu Kosan Co., Ltd.ASML Netherlands BVNippon Kayaku Co., Ltd.USM Ltd.Qingdao Haier Air Conditioner Co., Ltd.NOK Corp.Shimizu Corp.Evonik Operations GmbHHanon SystemsBabcock Hitachi KKHitachi Appliances, Inc.NEC Platforms Ltd.Maschinenfabrik Rieter AGHarris Intertype Corp.Sophia Co. Ltd.Sophia Co. Ltd.Qingdao Haier Washing Machine Co., Ltd.Freescale Semiconductor, Inc.SEMES Co., Ltd.Qingdao Haier Air Conditioning Electronics Co., Ltd.Qingdao Haier Washing Machine Co., Ltd.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Ericsson, Inc.The Boeing Co.Russia Federal Space AgencyThales GroupSNECMA SAKDDI Corp.Deutsche Telekom AGDeutsches Zentrum für Luft- und Raumfahrt e.V.Hosiden Corp.National Aeronautics & Space AdministrationHuf Hülsbeck & Fürst GmbH & Co. KGAmpex Corp.FCI SAT-Mobile USA, Inc.Nagravision SANisshinbo Micro Devices, Inc.Maspro Denkoh Corp.Korea Aerospace Research InstituteViaSat, Inc.Ball Corp.Yokowo Co. Ltd.Wistron NeWeb Corp.Telefónica SASECOM Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Japan Aerospace Exploration AgencyShenzhen Coship Electronics Co., Ltd.ArianeGroup SASIsrael Aerospace Industries Ltd.