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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.Seiko Epson Corp.Apple, Inc.Hewlett-Packard Development Co.Nikon Corp.Daewoo Electronics Co. Ltd.Renesas Electronics Corp.Yamaha Corp.Lenovo Group Ltd.Lenovo (Beijing) Co., Ltd.Advanced Micro Devices, Inc.Seagate Technology LLCKonica Minolta Business Technologies, Inc.Renesas Technology Corp.Arçelik ASWistron Corp.NEC Electronics Corp.Quanta Computer, Inc.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Lenovo (Singapore) Pte Ltd.Lite-On Technology Corp.Pilot Corp.Pilot Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.
IG Farbenindustrie AGNippon Shokubai Co., Ltd.Chunghwa Picture Tubes Ltd.SK Innovation Co., Ltd.Mercedes-Benz Group AGMikuni Corp.Cambridge Display Technology Ltd.Genetics Institute LLCWuxi Lead Intelligent Equipment Co., Ltd.Industrie De Nora SpASGL Carbon SEPromega Corp.Fenwal, Inc.Wuxi Lead Intelligent Equipment Co., Ltd.Zhejiang Jinko Solar Co. Ltd.Affymetrix, Inc.ModernaTX, Inc.Sartorius Stedim Biotech SASvenska Rotor Maskiner ABRoche Glycart AGSGL Carbon SELi-Tec Battery GmbHBallard Power Systems, Inc.10X Genomics, Inc.Xinxiang Medical UniversityDURECT Corp.Nanjing Medical UniversityBioverativ Therapeutics, Inc.Bioneer A/SSANYO Semiconductor Co., Ltd.
Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsInvensas Bonding Technologies, Inc.National Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Lightmatter, Inc.Brigates Microelectronics Inc.Tower Semiconductor Ltd.Pixelplus Co., Ltd.Akustica, Inc.AmberWave Systems Corp.MEMSIC, Inc.Sofics BVBASilicon Optronics, Inc.New Imaging Technologies SAXiroku, Inc.DecaWave Ltd.Luxtera, Inc.
Smart Packaging Solutions SASXiroku, Inc.
Geophysical Survey Systems, Inc.E-Wenco Srl
Japan Aviation Electronics Industry Ltd.Chicony Electronics Co., Ltd.Crucialtec Co., Ltd.Cirque Corp.Sysgration Ltd.Jiangsu Transimage Technology Co., Ltd.Jiangsu Transimage Technology Co., Ltd.Silitech Technology Corp.Solid Year Co. Ltd.Cellink Co., Ltd.UC-Logic Technology Corp.TopRay Technologies, Inc.Xiroku, Inc.Ortek Technology, Inc.Misung Polytech Co., Ltd.Sanwa Supply, Inc.NextInput, Inc.Contour Design, Inc.Fluidity Technologies, Inc.Shenzhen New Solution Electronics Co. Ltd.Ruwido Austria GmbHOTM Technologies Ltd.Lemo SAHoffmann & Krippner GmbHKinesis Corp.SMK-Link Electronic Corp.Suzuden Corp.VRmagic GmbHUnited Keys, Inc.GM Nameplate, Inc.