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Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
NaturalMotion Ltd.Reallusion, Inc.Kaydara, Inc.Mixamo, Inc.
LAPIS Semiconductor Co. Ltd.Asahi Kasei Microdevices Corp.MegaChips Corp.InvenSense, Inc.Hottinger Baldwin Messtechnik GmbHKionix, Inc.Hillcrest Laboratories, Inc.QuickLogic Corp.MEMSIC, Inc.AEye Technologies, Inc.Autobrains Technologies Ltd.Innoviz TechnologiesTRX Systems, Inc.Innovusion, Inc.Damon Motors, Inc.Standing Egg, Inc.Konux GmbHThales Visionix, Inc.Oculii Corp.InpixonSolfice Research, Inc.Vayavision Sensing Ltd.Ineda Systems, Inc.DynoSense Corp.Yost Engineering, Inc.ISWD Corp.Phantom AI, Inc.SenionLab ABindoo.rs GmbHTraxen, Inc.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.HELLA GmbH & Co. KGaAAnalog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Textron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KG
Alps Alpine Co., Ltd.NGK SPARK PLUG CO., LTD.Freescale Semiconductor, Inc.Analog Devices, Inc.Broadcom Corp.Rosemount, Inc.Dr. Johannes Heidenhain GmbHTakata, Inc.Keihin Corp.Asahi Kasei Microsystems Co., Ltd.Asahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.CTS Corp.Allegro MicroSystems LLCPacific Industrial Co., Ltd.Trimble Navigation Ltd.Watlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.InvenSense, Inc.ifm electronic GmbHCognex Corp.Preh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.Kistler Holding AGBorgWarner Ludwigsburg GmbHInterface, Inc.
Analog Devices, Inc.Safran SATrimble Navigation Ltd.InvenSense, Inc.iXBlue SASNovAtel, Inc.Northrop Grumman LITEF GmbHSparton Corp.Kionix, Inc.Block Engineering, Inc.Hillcrest Laboratories, Inc.MEMSIC, Inc.Sonardyne International Ltd.Honeywell AerospaceKearfott Corp.Taiwan Semiconductor Co., Ltd.Rockwell Collins Deutschland GmbHSilicon Sensing Systems Ltd.AOSense, Inc.Aceinna, Inc.Rockwell Collins UK Ltd.MicroStrain, Inc.The Fredericks Co.uAvionix Corp.SenionLab ABBaumer Holding AGSensonor Technologies ASStructured Materials Industries, Inc.