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Top 10 New Entrants companies in Brazing
by Most Patent Filing In 5 Years in the Japan in 2021

The Brazing top 10 is Discovery PatSnap’ annual ranking of the top 10 Most Patent Filing In 5 Years Brazing New Entrants in the Japan. Discovery has identified the top key players, startups & unicorns, fast-growings, news entrants in 2021, ranking from differnt perspectives, including patent filing intensity, academic research capability, news media heat. The company list is generated from various data types.
Brazing is a metal-joining process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a lower melting point than the adjoining metal.
#
Company Name
Region
Tech Topics
Total
1
National Institutes of Natural Sciences
Patent: 4
2
Nippon Micrometal Corp.
Solder ball,Printed electronics,Metal
Patent: 3
3
Toshiba Infrastructure Systems & Solutions Corp.
Social infrastructure,Automation,Mechanical engineering,
...[+2]
Patent: 3
4
Osaka University
Public university,Knowledge management,Chemistry,
...[+2]
Patent: 2
5
Amada Machines Tools Co., Ltd.
Machine tool,Automation,Manufacturing engineering,
...[+2]
Patent: 2
6
Nagaki Seiki KK
Patent: 2
7
Yamato Protec Corp.
Building design,Alarm device
Patent: 1
8
Gunma University
Angiogenesis inhibitor,Lampalizumab,Medicine,
...[+2]
Patent: 1
9
Hitachi Power Semiconductor Device Ltd.
Semiconductor,Power semiconductor device,Silicon carbide,
...[+2]
Patent: 1
10
Lumentum Japan, Inc.
Patent: 1
Page generation time: Jun 04 2025