Top 20 New Entrants companies in Automatic target recognition by Most Patent Filing In 5 Years in the world in 2021 – Discovery

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Ranking:

1	Goodrich Corp.	North Carolina, United States	Aerospace,Sales management,Industrial engineering, ...[+2]	Patent: 8
2	Hangzhou Dianzi University	Zhejiang Sheng, China	Pinyin,High-electron-mobility transistor,Public university, ...[+2]	Patent: 4
3	Zhejiang University	Zhejiang Sheng, China	Pinyin,Educational institution,Cancer immunotherapy, ...[+2]	Patent: 3
4	STARTUP Dev Lock Systems, Inc.	Colorado, United States	Information technology consulting,Systems design	Patent: 3
5	PLA Rocket Force University of Engineering	Shaanxi Sheng, China	Rocket,Artillery,Pinyin, ...[+2]	Patent: 3
6	IGLOO Corp.	South Korea	Security management,Network security,Conference management, ...[+2]	Patent: 2
7	Shandong Luneng Intelligent Technology Co. Ltd.	China		Patent: 1
8	Wuhan Institute of Technology	Hubei Sheng, China	Pinyin,Chemistry,Materials science, ...[+2]	Patent: 1
9	Shenzhen Weite Technology Co. Ltd.	Guangdong Sheng, China	Health care	Patent: 1
10	China Aeronautical Radio Electronics Research Institute	China		Patent: 1
11	Nanjing University of Science & Technology	Jiangsu Sheng, China	Suburban area,Pinyin,Computer science, ...[+2]	Patent: 1
12	Hohai University	Jiangsu Sheng, China	Water resources,Jurisdiction,Geotechnical engineering, ...[+2]	Patent: 1
13	China Railway Siyuan Survey & Design Group Co., Ltd.	China	Construction engineering	Patent: 1
14	McNally Construction, Inc.	Ontario, Canada	Construction engineering,Outfall,Seawall, ...[+2]	Patent: 1
15	Pearson Education, Inc.	New Jersey, United States	Publishing,Saddle,Professional development, ...[+2]	Patent: 1
16	207th Research Institute	China		Patent: 1
17	China Shanxi Sijian Group Co. Ltd.	Shanxi Sheng, China	Real estate development	Patent: 1
18	China Automotive Technology & Research Center	Tianjin Shi, China		Patent: 1
19	Zhejiang Hengshi Fiber Foundation Co., Ltd.	Zhejiang Sheng, China	Interior design	Patent: 1
20	Jiangsu University of Science & Technology	China	Package on package,Multi-chip module,Wafer-level packaging, ...[+2]	Patent: 1