Top 20 New Entrants companies in Ballistics by Most Patent Filing In 5 Years in the China in 2022 – Discovery

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Ranking:

1	National University of Defense Technology	Fujian Sheng, China	Computer science,Artificial intelligence,Mathematics, ...[+2]	Patent: 5
2	Northwestern Polytechnical University	Shanxi Sheng, China	Pinyin,Materials science,Composite material, ...[+2]	Patent: 3
3	Hubei Handan Mechatronics Co. Ltd.	Hebei Sheng, China		Patent: 2
4	Tencent Technology (Shenzhen) Co., Ltd.	Guangdong Sheng, China	Instant messaging,Information technology consulting,Systems design, ...[+2]	Patent: 2
5	Shanghai Aerospace Control Technology Institute	Shanghai Shi, China	Aerospace,Control system,National security	Patent: 2
6	Xi'an Modern Chemistry Research Institute	Shaanxi Sheng, China		Patent: 2
7	STARTUP Beijing Lanjian Konjian Technology Co. Ltd.	Beijing Shi, China	Rocket,Rocket engine,Launch vehicle, ...[+2]	Patent: 2
8	Nanjing University of Information Science & Technology	Jiangsu Sheng, China	Meteorology,Information science,Pinyin, ...[+2]	Patent: 2
9	Hefei University of Technology	Henan Sheng, China	Management science,Pinyin,Computer science, ...[+2]	Patent: 1
10	Yantai Hengda Polymer Co. Ltd.	China		Patent: 1
11	Hunan Sunward Science & Technology Co. Ltd.	China		Patent: 1
12	Zhengzhou Feilong Medical Equipment Co. Ltd.	China		Patent: 1
13	Nanyang North Xiangdong Industry Co. Ltd.	Henan Sheng, China	Electrical equipment,Computer hardware,Electronics	Patent: 1
14	Harbin Engineering University	Heilongjiang Sheng, China	Pinyin,Computer science,Control theory, ...[+2]	Patent: 1
15	Aerospace Long March Launch Vehicle Technology Co. Ltd.	China		Patent: 1
16	Beijing Research Institute of Mechanical & Electrical Tech	Beijing Shi, China		Patent: 1
17	Hunan University of Science & Technology	Hunan Sheng, China	Pinyin,Jurisdiction,Chemistry, ...[+2]	Patent: 1
18	STARTUP Beijing Onespace Technology Co. Ltd.	Beijing Shi, China	Aerospace,Launch vehicle,Spacecraft, ...[+1]	Patent: 1
19	Jiangsu University of Science & Technology	China	Package on package,Multi-chip module,Wafer-level packaging, ...[+2]	Patent: 1
20	Nanjing University of Aeronautics & Astronautics	Jiangsu Sheng, China	Astronautics,Molecular sensor,Solid-state battery, ...[+2]	Patent: 1