Top 20 New Entrants companies in Wafer by Most Patent Filing In 3 Years in the world in 2019 – Discovery

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Ranking:

1	Huaian Imaging Device Manufacturer Corp.	Jiangsu Sheng, China	Semiconductor,Image sensor,CMOS, ...[+2]	Patent: 5
2	Infineon Technologies Austria AG	Austria	Semiconductor,Microelectronics,Wafer, ...[+1]	Patent: 4
3	STARTUP Yangtze Memory Technologies Co., Ltd.	Hubei Sheng, China	Semiconductor,Flash memory,Solid-state drive, ...[+2]	Patent: 4
4	INNOX Advanced Materials Co., Ltd.	Chungcheongnam-do, South Korea	Semiconductor,OLED,Electronic component, ...[+1]	Patent: 4
5	SPTS Technologies Ltd.	Newport, United Kingdom	Semiconductor,Computer hardware,Inkjet printing, ...[+2]	Patent: 3
6	Meta Platforms Technologies LLC	California, United States	Software,Enterprise software,Publishing	Patent: 3
7	Hangzhou Haikang Micro-Image Sensor Technology Co., Ltd.	Zhejiang Sheng, China	Image sensor,Semiconductor,Resistor, ...[+2]	Patent: 3
8	Korea Basic Science Institute	South Korea	Association (object-oriented programming)	Patent: 2
9	MTI Ltd.	Yamanashi, Japan	Mobile device,FinTech,Music, ...[+2]	Patent: 2
10	SiEn (Qingdao) Integrated Circuits Co., Ltd.	Shandong Sheng, China	Tariff	Patent: 2
11	Zing Semiconductor Corp.	Shanghai Shi, China		Patent: 2
12	Walton Advanced Engineering, Inc.	Taiwan Province, China	Semiconductor,Flip chip,Electronic component, ...[+2]	Patent: 2
13	Xiamen San'an Integrated Circuit Co., Ltd.	Fujian Sheng, China	Information technology consulting,Semiconductor,Gallium arsenide, ...[+2]	Patent: 2
14	KLA Corp.	California, United States	Semiconductor,Computer hardware,Electronics, ...[+2]	Patent: 1
15	Semics, Inc.	South Korea	Software	Patent: 1
16	Intel IP Corp.	California, United States		Patent: 1
17	Nexchip Semiconductor Corp.	Anhui Sheng, China	Semiconductor,Electronic component	Patent: 1
18	Sino IC Technology Co. Ltd.	Shanghai Shi, China	Integrated circuit,Industrial production,Nondestructive testing, ...[+2]	Patent: 1
19	Puya Semiconductor (Shanghai) Co., Ltd.	Shanghai Shi, China	Electronics,Power transmission,Semiconductor, ...[+2]	Patent: 1
20	Boe Innovation Investment Co. Ltd.	Beijing Shi, China	Intelligent interface,Semiconductor,Internet of Things, ...[+2]	Patent: 1