Ranking Year:
# | Company Name | Region | Tech Topics | Total |
---|
1 | STATS ChipPAC Pte Ltd. | Semiconductor,Wafer-level packaging,Electronic component, ...[+2] | Patent: 16 | |
2 | GLOBALFOUNDRIES Singapore Pte Ltd. | Semiconductor,Semiconductor wafer fabrication,Electronic component | Patent: 5 | |
3 | Amkor Technology Singapore Holding Pte Ltd. | Patent: 3 | ||
4 | Broadcom International Pte Ltd. | Patent: 2 | ||
5 | Hoya Electronics Singapore Pte Ltd. | Electronics,Electronic component,Computer hardware, ...[+1] | Patent: 1 |