Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd.
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Basic Info
Headquarter
Beijing Shi, China
Founded Year
2013
Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd. is headquartered in China Beijing Shi. Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd. was founded in 2013. Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd. has a total of 6 patents
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Data Snapshot
Patent
Innovation Word Cloud
A quick overview of tech portfolio with the top keywords and phrases extracted from patents of Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd.
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High Related Markets
Mentioned companies in the market reports of major market categories and sectors by Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd.
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Innovation Matrix
visualizing technology portfolio of hot application areas and blank areas for Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd.
Time Range:
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Application Domain L2
Tech Topic L2
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Subsidiary Lists
Subsidiaries with patent applications for Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd.
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Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd. Frequently Asked Questions
What is Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd.'s total number of patents?
What kind of company is Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd.?
Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd., established on 2013-10-16, Business scope includes engineering...
Where is Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd.'s headquarters?
Beijing Tongda Green High Temperature New Material Engineering Research Center Co., Ltd. is located in Beijing Shi, China.
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