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LG Electronics, Inc.Sharp Corp.Nippon Telegraph & Telephone Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Oki Electric Industry Co., Ltd.Electronics & Telecommunications Research InstituteMotorola, Inc.NTT DOCOMO, Inc.Alcatel-Lucent S AShowa Denko Materials Co. Ltd.Western Electric Co., Inc.vivo Mobile Communication Co., Ltd.Resonac Corp.Fujikura Ltd.Hitachi Metals, Ltd.Nokia Siemens Networks OyChina Mobile Communications Group Co., Ltd.Lucent Technologies, Inc.China Mobile Communications Group Co., Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Orange SAChina United Network Communications Group Co., Ltd.Huawei Device Co., Ltd.China Telecom Corp. Ltd.Nubia Technology Co., Ltd.
Datang Mobile Communications Equipment Co. Ltd.Ericsson, Inc.Bose Corp.Hyundai WIA Corp.ViaSat, Inc.SoftBank Corp.Wistron NeWeb Corp.Rosenberger Hochfrequenztechnik GmbH & Co. KGSagemcom Broadband SASSilicon Laboratories, Inc.Sagemcom Broadband SASCETC Potevio Science & Technology Co., Ltd.The MathWorks, Inc.Askey Computer Corp.Faraday Technology Corp.Parrot SATP-LINK Technologies Co., Ltd.Arcadyan Technology Corp.ALAXALA Networks Corp.Wuhan Research Institute of Post & Telecommunications Co. Ltd.Italtel SpAParallel Wireless, Inc.VoiceAge Corp.T-Mobile International AG & Co. KGD-Link Corp.Shakespeare Co. LLCRearden LLCKymeta Corp.NETGEAR, Inc.Baicells Technologies Co., Ltd.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.TDK Corp.Thales GroupAlps Alpine Co., Ltd.Niterra Co., Ltd.Thales SAHamamatsu Photonics KKGoodrich Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.Freescale Semiconductor, Inc.HELLA GmbH & Co. KGaARTX Corp.LAPIS Semiconductor Co. Ltd.DePuy Synthes Products, Inc.Microchip Technology, Inc.Nabtesco Corp.The Georgia Tech Research Corp.TDK Electronics AGParker-Hannifin Corp.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Conti Temic Microelectronic GmbHTextron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.
The Boeing Co.Thales GroupSNECMA SAThales SAKDDI Corp.Ericsson, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.Deutsche Telekom AGHosiden Corp.Airbus Defence & Space GmbHNational Aeronautics & Space AdministrationHuf Hülsbeck & Fürst GmbH & Co. KGFCI SAAmpex Corp.Nisshinbo Micro Devices, Inc.ViaSat, Inc.Korea Aerospace Research InstituteMaspro Denkoh Corp.Yokowo Co. Ltd.Ball Corp.Wistron NeWeb Corp.Telefónica SAShenzhen Skyworth Digital Technology Co., Ltd.SECOM Co., Ltd.Japan Aerospace Exploration AgencyShenzhen Skyworth Digital Technology Co., Ltd.ArianeGroup SASShenzhen Coship Electronics Co., Ltd.Israel Aerospace Industries Ltd.China Academy of Space Technology
Intel Corp.Nippon Telegraph & Telephone Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Motorola, Inc.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyChina Mobile Communications Group Co., Ltd.MediaTek, Inc.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.HTC Corp.China Telecom Corp. Ltd.Nubia Technology Co., Ltd.KDDI Corp.Guangzhou Shiyuan Electronic Technology Co. Ltd.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsEricsson, Inc.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.Xilinx, Inc.Hosiden Corp.Microchip Technology, Inc.