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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
DISCO Corp.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.STATS ChipPAC Pte Ltd.ChipMOS Technologies, Inc.Powertech Technology, Inc.JCET Group Co., Ltd.Xintec, Inc.Amkor Technology, Inc.Lingsen Precision Industries Ltd.Transphorm Technology, Inc.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Japan Pure Chemical Co., Ltd.Plockmatic International ABFlipChip International LLCCONNECTEC JAPAN Corp.Micralyne, Inc.Palomar Technologies, Inc.F&S Bondtec Semiconductor GmbHWest Bond, Inc.
Taiwan Semiconductor Manufacturing Co., Ltd.SEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.MKS Instruments, Inc.STATS ChipPAC Pte Ltd.FormFactor, Inc.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGTongFu Microelectronics Co., Ltd.Xintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.FINETECH GmbH & Co. KG3D Plus SAS
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.Yamaha Motor Co., Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyThe Shenzhen Institutes of Advanced TechnologyWaymo LLCSRI InternationalRyobi Ltd.Shibuya Corp.Tatsuno Corp.Nachi-Fujikoshi Corp.