Tianshui Huatian Technology Co., Ltd. engages in the provision of semiconductor integrated circuits testing and packaging services. Its testing and packaging products include DIP, SOT, SOP, SSOP, TSSOP, LQFP, MCM(MCP), MEMS, BGA, LGA, SiP, TSV-CSP and others. The company was founded on December 25, 2003 and is headquartered in Tianshui, China.